|
Printable Version |
|
|
|
|
|
Front end (cad,cam, drc) |
Pentium III's running Barco UCam
|
|
Shop floor control system |
Partial manual - electronic |
|
Photoplotter |
Crescent
Photoplotter |
|
Artwork AOI |
Camtek 2V50, Camtek Orion 707 |
|
Innerlayer
pre-clean |
Hyoki pumice
scrubber |
|
Innerlayer film application |
Morton Electronics 1600 I.V.
cut-sheet laminator |
|
Innerlayer
expose |
CoLight DMVL
1530, Tamarak 161B, with Glass Phototooling |
|
Innerlayer cleanroom
|
Class 100,000 (positive
airflow, HEPA filtration, clothing and paper controls) |
|
Innerlayer DES |
FSI 24-56-EO
DES Line |
|
Material punch |
CA Picard |
|
AOI
/Verification |
Camtek 2V50, Camtek Orion 707 |
|
Lamination tooling system |
CA Picard |
|
Real time
x-ray |
Nicolet
Imaging System |
|
Drill machines |
Dynamotion "SixPak" |
|
Total number
of spindles |
24 total |
|
Imaging |
Nicolet - X-Ray Imaging System |
|
Broken bit
detection (all m/c) |
yes |
|
Run-out detection |
yes |
|
Deburr |
Marseco
deburr/scrubber |
|
Post drill hole clean |
High pressure -
ultra-sonic-fluid wedge |
|
Missing/blocked
hole detection |
Performed
in-process first hole - last hole coupon verification |
|
Electroless line |
Manual lines - 30" X 24" (3
tanks) |
|
Outerlayer
film application |
Morton
Electronics 1600 I.V. cut-sheet laminator |
|
Outerlayer expose |
CoLight 1630 |
|
Outerlayer
cleanroom class |
Class 100,000
(positive airflow, HEPA filtration, clothing and paper controls) |
|
Outerlayer developer |
FSI 24-11-PW Developer |
|
Electrolytic
plating |
Manual HARP (High Aspect Ratio Plating) line
24" X 36" |
|
Strip, etch, tin strip |
FSI 24-56-EO Etcher |
|
Soldermask
coating |
Circuit
Automation DP 1500 screen coater |
|
Soldermask tack cure oven |
Circuit Automation TC 120
tunnel oven |
|
Soldermask
cleanroom class |
Class 100,000
(positive airflow, HEPA filtration, clothing and paper controls |
|
Soldermask expose |
CoLight 1630 |
|
Soldermask
tooling |
CA Picard |
|
Soldermask final cure oven |
Circuit Automation TC 120
tunnel oven |
|
Hot air
solder level |
Lantronics |
|
Electrolytic (hard) Gold gold |
Technic Manual Plate System, High Aspect Ratio Plating (HARP) |
|
Tab plate |
Technic Mini
FFP Tab-Plater |
|
OSP |
Enthone OSP - Entek |
|
Immersion
silver |
Oliver Sales |
|
Immersion Tin |
Florida Cirtech - Omikron
Immersion Tin |
|
TDR |
In-house CITS800s |
|
Routers |
PDA P/C 50 w/software upgrade ,
PDA 350 Router Skorsaw |
|
Electrical
test |
TTI 3400
Universal Grid, Mania Speedy-Flying Probe, Probot 880 |
|
Test fixture drill / manufacture |
Dynamotion "SixPack" |
|
Process Laboratory |
Perkin-Elmer
Analyst 100 AA Unit ; Buehler High Volume Microsection Unit; Spectronic
21 Spectrophotometer; Microscope Unitron with CCTV and Printer ;
Archive 4 Micro Sectioning Data Software ; Complete in-house process
chemistry analysis capability; Omega Meter ; |
| Metrology lab |
Internal - manual measuring equipment -
Outside - sensitive or electronic devices |
ENIG |
Shipley Ronamerse |
|
|
